Modi semiconductor

1. PM Modi to lay foundation stone for three semiconductor projects worth ₹1.25 lakh crore.
2. Addressing youth nationwide, PM Modi will mark the occasion via video conferencing.
3. The projects aim to bolster India’s semiconductor industry and create numerous job opportunities.

New Delhi, March 13: Prime Minister Narendra Modi is scheduled to lay the foundation stone of three semiconductor projects valued at approximately ₹1.25 lakh crore today through video conferencing.

Alongside this event, he will address youth from across the country, as stated by the Prime Minister’s Office (PMO).

The three significant projects for which the foundation stone will be laid include the Semiconductor fabrication facility at the Dholera Special Investment Region (DSIR) in Gujarat, and Outsourced Semiconductor Assembly and Test (OSAT) facilities in Morigaon, Assam, and Sanand, Gujarat.

In a post on X, Modi expressed anticipation for the event, emphasizing its importance in India’s journey to become a semiconductor hub. He invited students from over 60,000 institutions to participate and urged young tech enthusiasts to join the program.

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These projects align with the Prime Minister’s vision to position India as a leading global center for semiconductor design, manufacturing, and technology development, thereby creating numerous job opportunities for the country’s youth.

The semiconductor fabrication facility at the Dholera Special Investment Region (DSIR) will be established by Tata Electronics Private Limited (TEPL) under the Modified Scheme for setting up semiconductor fabs in India.

With an investment exceeding ₹91,000 crore, this marks the inauguration of the country’s first commercial semiconductor fab.

Additionally, the Outsourced Semiconductor Assembly and Test facility in Morigaon will be developed by Tata Electronics Private Limited (TEPL) under the Modified Scheme for Semiconductor Assembly, Testing, Marking, and Packaging (ATMP), with an investment of about ₹27,000 crore.

The OSAT facility in Sanand will be established by CG Power and Industrial Solutions Limited under the Modified Scheme for Semiconductor Assembly, Testing, Marking, and Packaging (ATMP), with an investment of approximately ₹7,500 crore.

These initiatives are poised to strengthen the semiconductor ecosystem in India, providing a robust foundation for its growth.

Moreover, the facilities are expected to create employment opportunities for thousands of youth within the semiconductor industry and stimulate job creation in allied sectors such as electronics and telecommunications.